JPH028135U - - Google Patents
Info
- Publication number
- JPH028135U JPH028135U JP8724488U JP8724488U JPH028135U JP H028135 U JPH028135 U JP H028135U JP 8724488 U JP8724488 U JP 8724488U JP 8724488 U JP8724488 U JP 8724488U JP H028135 U JPH028135 U JP H028135U
- Authority
- JP
- Japan
- Prior art keywords
- processing head
- semiconductor wafer
- moves
- semiconductor manufacturing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000012634 fragment Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8724488U JPH028135U (en]) | 1988-06-29 | 1988-06-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8724488U JPH028135U (en]) | 1988-06-29 | 1988-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH028135U true JPH028135U (en]) | 1990-01-19 |
Family
ID=31311862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8724488U Pending JPH028135U (en]) | 1988-06-29 | 1988-06-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH028135U (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS556742U (en]) * | 1978-06-30 | 1980-01-17 | ||
JPH0495356U (en]) * | 1991-01-11 | 1992-08-18 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61158138A (ja) * | 1984-12-28 | 1986-07-17 | Nec Kansai Ltd | ウエハ表面の突起物除去装置 |
JPS6229130A (ja) * | 1985-07-30 | 1987-02-07 | Toshiba Corp | 半導体ウエ−ハの異物除去方式 |
-
1988
- 1988-06-29 JP JP8724488U patent/JPH028135U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61158138A (ja) * | 1984-12-28 | 1986-07-17 | Nec Kansai Ltd | ウエハ表面の突起物除去装置 |
JPS6229130A (ja) * | 1985-07-30 | 1987-02-07 | Toshiba Corp | 半導体ウエ−ハの異物除去方式 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS556742U (en]) * | 1978-06-30 | 1980-01-17 | ||
JPH0495356U (en]) * | 1991-01-11 | 1992-08-18 |